OUR SERVICES
Precision GPU and HBM rework, power-delivery repair, PCIe circuit restoration, and platform-specific diagnostics.
Reballing, solder-joint repair, and replacement of GPU and high-bandwidth memory components, based on the package design and confirmed fault.
Diagnose failed power phases and repair damaged DrMOS power stages, PWM controllers, and associated power-delivery circuits.
Restore damaged PCIe edge contacts and signal paths. Repair accessible multilayer PCB traces with precision jumper-wire reconstruction.
Perform in-depth GPU diagnostics and stress testing using Inventec OEM test scripts in a compatible, configured driver and host environment.
GPU and HBM work is assessed by package design, fault location, and replacement-part availability. Solder-joint repair and component replacement do not repair damaged silicon internally.
CORE REPAIR CAPABILITIES
Assess GPU and high-bandwidth memory solder connections to determine whether reballing, localized solder-joint rework, or component replacement is appropriate. The service plan reflects the actual package construction and the location of the fault.
Physical die or internal memory-stack damage requires a replacement assessment; it cannot be corrected by repairing external solder joints alone.
Trace power faults to failed DrMOS stages, PWM controller ICs, or associated components. Replace damaged parts and check the repaired phase before validating the GPU under load.
Repair damaged gold-finger contacts and broken PCB connections that prevent a card from initializing or communicating reliably. Accessible multilayer trace damage can be addressed with localized reconstruction and precision jumper wiring.
The affected layer, extent of damage, and signal-integrity requirements determine whether a trace can be restored reliably.
Configure compatible GPU drivers and host test environments for in-depth diagnostics and stress testing with Inventec OEM test scripts. Test selection follows the GPU model, host platform, and available script support.
Cooling contact, thermal materials, and airflow are also reviewed when temperature behavior affects validation.
HARDWARE WE SERVICE
Our primary specialty: board-level diagnostics and repair for enterprise GPU hardware. The exact module or card, part number, and host platform determine the service plan.
GPU inquiry ↗Repair for consumer, workstation, and compute GPUs. Common inquiries include no display, power faults, unstable operation, damaged connectors, and cooling problems.
PCIe card inquiry ↗For an uncertain fault or previous repair attempt, start with an assessment. Include the board condition, known history, and any existing logs or test results.
Request an assessment ↗COMMON FAULTS
Symptoms guide the investigation. The confirmed cause determines the repair; similar symptoms can come from different faults.
Unpowered resistance checks and controlled power testing help isolate shorted rails, failed power components, or abnormal sequencing.
Review device recognition, power enables, clock and reset conditions, firmware compatibility, and host configuration.
Correlate memory errors with compatible tests and board-level findings. Assess GPU or HBM solder-joint rework and component replacement according to the confirmed fault and package design.
Compare behavior at idle and under an appropriate workload. Review power stability, temperature, error logs, and host integration.
Inspect cooling contact, thermal interface condition, airflow, and fan operation where applicable. Verify temperature behavior after service.
Assess PCIe gold-finger contacts, connectors, solder joints, and multilayer PCB traces. Review contact restoration and precision jumper-wire repair according to the affected layer, damage extent, and signal requirements.
DIAGNOSTIC COVERAGE
| Review area | Typical checks | Purpose |
|---|---|---|
| Physical condition | Connectors, components, solder joints, and prior work | Record condition and identify damage before power-on |
| Power delivery | Resistance, rail voltages, DrMOS stages, PWM controllers, and power sequencing | Isolate power faults and shorted components |
| Signals & initialization | PCIe contacts, trace continuity, clock, reset, and link behavior | Investigate failures to initialize or communicate |
| Functional behavior | Device recognition, GPU / HBM error checks, and supported Inventec OEM diagnostics | Confirm operation in a compatible test platform |
| Load & cooling | Inventec OEM stress-test scripts where supported, workload stability, and temperature behavior | Validate the agreed operating conditions |
Test coverage and pass criteria are agreed for the hardware, host environment, and available authorized tools. Package work and PCB reconstruction require a feasibility review before repair.
Discuss Your Device ↗This website provides information about Tokdraw LLC repair services. Submitting an inquiry does not authorize work or guarantee that a device is repairable.
The actual diagnostic fee, repair price, parts, shipping, taxes, and service timing must be confirmed in an individual written quote. Repair work requires customer approval.
Wait for intake confirmation and shipping instructions before sending equipment. Back up accessible data and remove credentials. Component replacement is subject to compatibility, board condition, and parts availability.
Payment, warranty coverage, return shipping, unrepairable devices, and any enterprise SLA or NDA must be addressed in the accepted service agreement. Brand names identify supported hardware and do not imply manufacturer affiliation or authorization.
The repair form asks for your name, company name, email, device model, and a description of the issue so that your service request can be reviewed and answered.
Entered information remains in this page until you leave or refresh it. Preparing a request does not send it. The email-draft link opens your email application with the details addressed to the service contact listed in the footer; you choose whether to send it. Downloading a request creates a text file on your device.
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Do not include passwords, access tokens, payment card details, or confidential customer data. Confidential enterprise information should be exchanged through an agreed channel after any required NDA is in place.