OUR SERVICES

GPU repair, at the right level

The reported symptom starts the investigation. Board condition, electrical measurements and platform testing determine whether the next step is circuit repair, component rework or a replacement assessment.

SUPPORTED HARDWARE

Repair services by GPU family

NVIDIA A100 40GB / 80GB

40GB and 80GB versions, each in PCIe or SXM4 form. Diagnosis and board-level repair.

A100 repair

NVIDIA H100 80GB

PCIe and SXM5 versions. Assessment of power delivery, device recognition and interconnect behavior.

H100 repair

NVIDIA H200

Power, cooling and HBM3e-related fault assessment in a compatible host environment.

H200 repair

PCIe graphics & compute

GeForce RTX 30/40, RTX A-series, A10/A30/A40 and L40/L40S. View the supported model list.

PCIe card repair

PCIe MODELS

Consumer, professional and data center cards

GeForce RTX 30 Series

Consumer PCIe graphics cards.

RTX 3060
RTX 3070
RTX 3080
RTX 3090

GeForce RTX 40 Series

Consumer PCIe graphics cards.

RTX 4060
RTX 4070
RTX 4080
RTX 4090

Professional RTX A Series

Professional workstation PCIe cards.

RTX A2000
RTX A4000
RTX A5000
RTX A6000

Data center PCIe GPUs

Server and data center GPU cards.

A10
A30
A40
L40
L40S

Repair service is available for the listed models, subject to inspection and parts availability. Confirm the manufacturer, exact model, memory capacity and part number at intake. Ti, SUPER and other board variants require a separate compatibility review.

PCIe repair routes

CAPACITY & FORM FACTOR

A100 40GB / 80GB and H100 80GB

GPU variant	Memory	Form factor	Assessment requirements
A100 40GB PCIe	40GB HBM2	PCIe card	PCIe host and cooling matched to the exact board.
A100 80GB PCIe	80GB HBM2e	PCIe card	80GB-specific assembly and compatible test configuration.
A100 40GB SXM4	40GB HBM2	SXM4 module	Compatible SXM4 carrier, power and cooling arrangement.
A100 80GB SXM4	80GB HBM2e	SXM4 module	80GB SXM4 assembly, carrier and package compatibility review.
H100 80GB PCIe	80GB HBM2e	PCIe card	PCIe assembly, host power and system cooling.
H100 80GB SXM5	80GB HBM3	SXM5 module	Compatible SXM5 carrier, power and cooling arrangement.

40GB and 80GB are separate A100 configurations. The H100 repair variants listed here are 80GB. Capacity, package and board form factor must all match the assessment and replacement parts.

REPAIR CAPABILITIES

What the repair can involve

Power delivery & VRM repair

Locate failed power stages, controllers or supporting components. Repair the confirmed circuit fault and verify stable power before functional testing.

Power-fault diagnosis

BGA rework & package assessment

Evaluate solder connections and component condition before reballing or replacement. GPU and HBM work depends on package construction and fault location.

Rework and validation

PCIe contacts & PCB repair

Assess damaged edge contacts, pads and accessible traces. Deep substrate damage may require a compatible replacement PCB and component-transfer assessment.

PCB repair routes

Memory & stability diagnostics

Investigate repeatable memory errors, driver timeouts and failures under load. Correlate logs with hardware tests before choosing a repair.

Memory-fault diagnosis

Interconnect & platform checks

Assess the GPU alongside its slot or carrier and software environment. Review PCIe or NVLink behavior only on a configuration that supports the required test.

Link-fault diagnosis

NVIDIA diagnostics & stress testing

We use NVIDIA-developed diagnostic software on supported GPU and platform configurations, alongside targeted stress testing, to identify faults and verify stability after repair. Cooling, temperature and power behavior are reviewed during testing.

Post-repair checks

SCOPE & FEASIBILITY

Repair, replace, or stop

Targeted repair

A serviceable board with a localized, accessible fault may be suitable for component replacement, trace repair or controlled rework.

Replacement assessment

Damaged PCB structure or a failed package requires a review of compatibility, part availability, remaining component condition and cost.

Return without repair

If the proposed work is not viable or not approved, we document the findings and agree on return arrangements with you.

Physical silicon damage and internal HBM-stack faults are outside ordinary solder-joint repair. We confirm feasibility for the actual assembly before quoting that work.